Multilayer ceramic technology (MLCC) is a widely used technology in the modern electronics industry, employed in the manufacturing of multilayer capacitors and other electronic components. MLCC (Multilayer Ceramic Capacitor), LTCC (Low-Temperature Co-fired Ceramic), and HTCC (High-Temperature Co-fired Ceramic) are the three main types of multilayer ceramic technologies. Their differences lie primarily in materials, sintering temperature, manufacturing processes, and application fields.

1. MLCC (Multilayer Ceramic Capacitor)

• Dielectric Materials: Barium titanate (BaTiO₃), titanium oxide (TiO₂), calcium zirconate (CaZrO₃), or other dielectric ceramic materials.
• Metallic Materials:
  • Internal electrodes: Nickel (Ni), copper (Cu), silver (Ag), or palladium-silver alloy (Pd/Ag).
  • Termination electrodes: Copper (Cu), silver (Ag).
• Sintering Temperature: Typically ranges from 1100°C to 1350°C.
• Product Type: Capacitors
• Application Fields: Widely used in consumer electronics, automotive electronics, communication devices, etc.

Fabrication Process Flow

Diagram: Manufacturing Process of MLCC

2.Low - Temperature Co - fired Ceramics (LTCC)

Dielectric materials: Glass - ceramics, ceramic - glass composites, and glass - bonded ceramics, etc.

Metal materials: Low - melting - point metals such as silver (Ag), gold (Au), copper (Cu), palladium - silver (Pd/Ag), etc.

Sintering temperature: Generally between 800°C and 950°C.

Product types: Filters, duplexers, couplers, baluns, antennas, ceramic substrates, ceramic packaging housings, etc.

Application fields: Mainly used in high - frequency circuits, radio - frequency modules, microwave circuits, etc.

Fabrication Process Flow

Figure: LTCC Manufacturing Process

3.HTCC (High-Temperature Co-fired Ceramic)

• Dielectric Materials: High-temperature ceramic materials such as alumina (Al₂O₃), aluminum nitride (AlN), or zirconium oxide (ZrO₂).
• Metallic Materials: High-melting-point metals like tungsten (W), molybdenum (Mo), and manganese (Mn).
• Sintering Temperature: Generally ranges from 1600°C to 1800°C.
• Product Types: Ceramic substrates, ceramic packaging shells, heating elements, sensors, etc.
• Application Fields: Suitable for high-temperature, high-power, and high-frequency applications, such as power electronics, sensors, and aerospace electronic devices.

Fabrication Process Flow

Figure: HTCC Manufacturing Process

1. Ceramic green tape cutting
2. Via hole drilling
3. Pattern printing
4. Lamination 
5. Pressure - assisted zero - shrinkage sintering
6. Surface treatment
7. Plating
8. Brazing process
9. Cutting

The technological processes of MLCC, LTCC, and HTCC are generally similar. A typical multilayer ceramic technological process includes green tape casting, screen printing, lamination, laminating, cutting, firing, etc. However, there are significant differences in some details. For example, the MLCC process does not require drilling holes and directly prints the internal electrode paste, while LTCC and HTCC are drilled as needed. Due to the different materials selected for LTCC and HTCC, the temperature and atmosphere of the sintering process are different.

Graphic source: Aibang.
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