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Warm Isostatic Pressing (WIP) is a critical advanced forming technology that uses deionized water as the pressure medium to achieve uniform densification of green bodies under moderate temperature (50-200℃) and high pressure (100-600MPa) conditions. Its core advantages of uniform pressure distribution, precise temperature control, and clean processing make it indispensable in high-performance manufacturing sectors globally. This report focuses on WIP's applications in two key industries: ceramics and energy storage, highlighting its value in green body forming for international markets.

The Electrostatic Chuck (ESC) is an ultra-clean wafer carrier suitable for vacuum and plasma working environments. It utilizes the principle of electrostatic adsorption to clamp ultra-thin wafers in a flat and uniform manner. In integrated circuit manufacturing, it serves as a core component in high-end equipment such as thin-film equipment, etchers, ion implanters, and metrology equipment.

Electrostatic Chucks (Electrostatic Chuck, abbreviated as ESC) play an important role in modern high-tech manufacturing processes, especially when handling precision objects such as silicon wafers. They firmly hold workpieces in place through electrostatic force, eliminating the need for traditional mechanical fixtures or vacuum suction, thus simplifying the manufacturing process. Unlike vacuum chucks, electrostatic chucks do not rely on pressure differences, enabling better control and flexibility in wafer processing. Electrostatic chucks are widely used in processes such as plasma etching, chemical vapor deposition (CVD), and ion implantation in semiconductor manufacturing.

MLCC (Multi-layer Ceramic Capacitor), also known as chip capacitor, laminated capacitor, stacked capacitor, etc., is one of the most widely used capacitors. MLCC is formed by stacking ceramic dielectric films printed with electrodes (internal electrodes) in a staggered manner, sintering them at high temperature to form a ceramic block, and then sealing metal layers (external electrodes) at both ends of the ceramic block.