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China Suppliers Factory Automatic Punching Machine for Green Ceramic Tapes with Customizable Punching Heads

Introducing our advanced Punching Machine, specifically engineered for precision hole punching in green ceramic tapes. This high-quality equipment is perfect for manufacturers looking to enhance their production efficiency. Our factory in China offers customizable punching heads to meet your specific needs, ensuring that you receive the tailored solutions you require. As leading suppliers in the industry, we are committed to delivering innovative machinery that supports your manufacturing processes. Enhance your production capability today with our reliable Punching Machine!

    Overview

    DL-CK-8SE200 Punching Machine is primarily used to take the film tape, which has been directly casting into rolls, and cut it into sheets of user-specified dimensions. These sheets are then fixed to a metal frame using vacuum suction. They are subsequently transported to the punching area via a screw rod guide, where they are punched according to pre-programmed punching patterns set by the user. The punched green bodies are then automatically picked up by a robotic arm and placed in a designated position in the material box.
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    Features a compact footprint with an adjustable load-bearing caster base for flexible use.
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    High positioning accuracy with a maximum error range of 0.01 mm.
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    Equipped with multiple sets of customizable punching heads.
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    Punching speed is consistent at 15 times per second; can reach up to 20 times per second when the punching distance is 1x1 mm.
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    Utilizes mechanical punching, suitable for fired ceramics.
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    Supports sheet sizes up to 180x180 mm.
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    Punch unit is modular for easy replacement.

    Cutting-edge Features

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    Direct import of CAD files for seamless operation.
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    Equipped with a CCD vision alignment system for precise positioning.
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    Supports secondary positioning for enhanced accuracy.
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    Includes a punch breakage detection device for improved reliability and maintenance.
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    Can be equipped with an automatic feeding system.
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    Can be equipped with a sheet placing and lifting conveyor system.

    Technical Specifications

    Punching speed 15 times /s spacing 1*1mm 20 times /s
    Punching area 180*180mm
    Tape thickness 500 μm
    Positioning accuracy ±0.01mm
    Programming CAD file input
    Work (sheet) fixing Through vacuum, adsorbed to the metal frame fixed
    Carrier film thickness 25-100 μm
    Punching pin exchange Manual replacement
    Control Industrial computer
    Pin breakage test With camera and visual control
    Tape handling Automatic adsorption to material box
    Safety Meet CE standard
    Dimensions 1720*1100*1920cm
    Compressed air 2L/s
    Vacuum Equipped with vacuum pump

    Frequently Asked Questions

    Q1: What is the primary application of the DL-CK-8SE200 Punching Machine?
    It is designed to take film tape directly cast into rolls, cut it into sheets, fix them to a metal frame using vacuum suction, and perform precise punching based on pre-programmed user designs.
    Q2: What is the positioning accuracy of this machine?
    The machine delivers high positioning accuracy with a maximum error range of ±0.01 mm, supported by a CCD vision alignment system and secondary positioning capabilities.
    Q3: What is the maximum punching speed of the DL-CK-8SE200?
    The punching speed is consistent at 15 times per second and can reach up to 20 times per second when the punching distance is set to 1x1 mm.
    Q4: How are files and programming managed on this machine?
    The system is controlled by an industrial computer and supports the direct import of CAD files for seamless, precise programming.
    Q5: What safety and monitoring features are integrated?
    It features a punch breakage detection device utilizing a camera and visual control, and the entire system complies with CE safety standards.
    Q6: What sheet dimensions and tape thicknesses does it support?
    It supports sheet sizes up to 180x180 mm, tape thicknesses up to 500 μm, and carrier film thicknesses ranging from 25 to 100 μm.

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